Home / Global Technology / Renesas collaborates with TSMC on 28nm MCU for Next-Gen Green and Autonomous Vehicles

Renesas collaborates with TSMC on 28nm MCU for Next-Gen Green and Autonomous Vehicles

RenesasJapanese semiconductor giant Renesas Electronics Corporation and Taiwan-basedTSMC joined hands to carryout 28 nanometer (mm) embedded flash (eFlash) process technology for manufacturing microcontrollers (MCUs) for next-generation green and autonomous vehicles.

The automotive MCUs featuring this new 28nm process technology will see sample shipment in 2017 and mass production in 2020.

Renesas already collaborated with TSMC on MCUs with on-chip flash memory since the 90nm technology generation.

After four years of working together on 40nm MCU platform, the electronic giants are now extending their partnership to develop 28nm MCUs

Through this, Renesas’ fast Metal-Oxide-Nitride-Oxide-Silicon (MONOS) eFlash technology will combine with TSMC’s high-performance, low-power 28nm high-K metal gate process technology to produce the world’s leading automotive MCUs.

This can be used for a broader range of applications such as autonomous vehicle sensor control, coordinated control among electronic control units (ECUs), fuel-efficient engine control for green vehicles, and highly efficient motor inverter control for electric-driven vehicles.

Next-generation MCUs can fulfill the safety requirements of autonomous cars since they enable high-precision sensing using 3D radar to monitor the environment surrounding the vehicle, integration of data from multiple sensors, as well as real-time judgment processing for autonomous operation.

Ryuji Omura, Executive Vice President, Renesas Electronics Corporation. “Innovative semiconductor technology is essential to accelerate the development of next-generation automobiles, and I am confident that the collaboration with TSMC on the technology development of next-generation MCUs will deliver enhanced peace of mind regarding the stable supply to our customers into the future.”

Other features of the new MCUs include the use of multiple CPU cores, more advanced security, and support for multiple interface standards.

According to Dr. BJ Woo, TSMC’s Vice President, Business Development. “By leveraging TSMC’s 28nm high-performance, energy-efficient technology, we believe we can showcase how best we optimize one of our advanced technologies to meet the demands and innovation for the next generation of automotive devices and deliver a highly competitive performance/cost advantage.”

About Anitha

Avatar
Backed by over 10 years experience with India’s top media house “The New Indian Express”, Anitha is interested in writing all aspects of automobile industry. Her qualification MSc (Industrial-Psychology) helps her to deeply analyse the auto manufacturing industry.

Check Also

Renesas to strengthen automotive portfolio by acquiring Intersil

Semiconductor giant Renesas Electronics Corporation will strengthen its automotive portfolio by acquiring Intersil Corporation, a …

Leave a Reply